DA14531MOD-00F01002

Part: DA14531MOD — Renesas Type: Bluetooth LE Module Description: A SmartBond TINY Bluetooth Low Energy module based on the DA14531 SoC, featuring a 32-bit Arm Cortex M0+ processor, 128 kB internal FLASH, and an integrated antenna, designed for low-power IoT applications.

Operating Conditions:

• Supply voltage: 1.8 V - 3.6 V
• Operating temperature: -40 to +125 °C

Absolute Maximum Ratings:

• Max supply voltage: 3.6 V
• Max junction/storage temperature: 150 °C

Key Specs:

• Core: 16 MHz 32-bit Arm Cortex M0+
• Internal FLASH: 128 kB
• RAM: 48 kB
• ROM: 144 kB
• OTP: 32 kB
• RX current consumption: 2 mA (at VBAT = 3 V)
• TX current consumption: 4 mA (at VBAT = 3 V and 0 dBm)
• Sleep current consumption: 1.8 μA (with all RAM retained)
• RF transmit power: -19 to +2.2 dBm
• Receiver sensitivity: -93 dBm

Features:

• Compatible with Bluetooth v5.1
• Supports up to three connections
• Renesas registered BD address preprogrammed in OTP
• Quadrature decoder with three channels
• Three channel 11-bit ENOB ADC
• Two general purpose timers with PWM
• Nine GPIOs
• SPI, 2x UART (1-wire UART support), I2C interfaces
• Real Time Clock
• Trimmed 32 MHz Crystal
• Configurable DSPS and Codeless v2.0 software support

Applications:

• Beacons
• Remote Controls
• Proximity tags
• Low Power Sensors
• Commissioning/provisioning
• RF pipe
• Toys
• Industrial applications
• Data acquisition
• Wellness
• Infotainment
• IoT
• Robotics
• Gaming

Package:

• 12.5 mm x 14.5 mm x 2.8 mm module

• Bluetooth ®

• Compatible with Bluetooth ® v5.1,

• ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47 Part 15 (US) and ARIB STD-T66 (Japan) core

• Supports up to three connections

• Renesas registered BD address preprogrammed in OTP

• Processing and memories

• 16 MHz 32-bit Arm ® Cortex ® M0+ with SWD interface

• 128 kB internal FLASH

• 48 kB RAM

• 144 kB ROM

• 32 kB OTP

• Current Consumption

• 2 mA RX at VBAT = 3 V

• 4 mA TX at VBAT = 3 V and 0 dBm

• 1.8 μA at sleep with all RAM retained

• Radio

• Programmable RF transmit power from -19 to +2.2 dBm

• -93 dBm receiver sensitivity

• Power Management

• Operating range (1.8 V - 3.6 V)

• Inrush current control

• Interfaces

• Quadrature decoder with three channels

• Three channel 11-bit ENOB ADC

• Two general purpose timers with PWM

• Nine GPIOs

• SPI

• 2x UART, 1-wire UART support

• I2C

• Packaging

• 12.5 mm x 14.5 mm x 2.8 mm package

• Module Software Development Kit

• Configurable DSPS

• Codeless v2.0

• SDK6 support

• Module Software Tools

• Flash/OTP programmer

• SUOTA support

• Battery Life Estimation

• Data Rate Monitoring

• Real-Time Power Profiling

• Production Line Testing

• Standards Conformance

• BT SIG QDID 113959

• Europe (CE/RED/UKCA) and US (FCC)

• Canada (IC) and Japan (MIC)

• Other

• Real Time Clock

• Trimmed 32 MHz Crystal

• Beacons
• Remote Controls
• Proximity tags
• Low Power Sensors
• Commissioning/provisioning
• RF pipe
• Toys
• Industrial applications
• Data acquisition
• Wellness
• Infotainment
• IoT
• Robotics
• Gaming
• South Korea (KC) and Taiwan (NCC)
• South Africa (ICASA) and Brazil (ANATEL)
• China (CMIIT) and Thailand (NBTC)
• India (WPC)

DA14531MOD-00F01002 Pinout

Package: LCC-16 (14.5×12.5 mm)

Notes

• Type A vs Type B pads: Type A is a normal IO pad with Schmitt trigger on input. Type B has an extra RC Filter with 100 kHz cutoff frequency.
• Dual-function pins: J9 (P0_10/SWDIO), J10 (P0_2/SWCLK), and J12 (P0_0/RST) have alternate functions. SWDIO and SWCLK are the default debug interface functions.
• J1 connection: J1 has no internal connection and should be connected to ground externally.
• SPI Flash: Pin J12 (P0_0/RST) is also used for communication to the internal SPI Flash.
• State retention: All DIO pins contain a state retention mechanism during power down.

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, so functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specification are not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability.

Table 2: Absolute maximum ratings

Table 3: Recommended operating conditions

There are some special considerations for the use of the DA14531 TINY TM module, namely:

• The RST signal is shared with the MOSI input of the NOR flash. For this reason, RST must not be driven to GND. When the internal Flash is in use, the reset functionality is not available.
• The SPI Bus of DA14531 is used for the communication of the SoC with the NOR Flash at boot time. Three of the four signals are not driven to external module pins. For this reason, a sensor that utilizes the SPI bus must be assigned (by software) to the module pins to communicate with after the boot is completed and when NOR Flash is no longer in use. An example is given in Figure 8.

Figure 8. Example of connecting a sensor to the SPI bus and an MCU to RST and UART

The module's dimensions are accessible from the Renesas website - 16-Module.