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CL32B226KOJNNNE

Multilayer Ceramic Capacitor

The CL32B226KOJNNNE is a multilayer ceramic capacitor from Samsung Electro-Mechanics. View the full CL32B226KOJNNNE datasheet below including key specifications.

Manufacturer

Samsung Electro-Mechanics

Category

Multilayer Ceramic Capacitor

Package

1210

Key Specifications

ParameterValue
Capacitance22uF
Temperature CoefficientX7R
Tolerance±10%
Voltage Rating16V

Overview

Part: CL Series — Samsung Electro-mechanics

Type: Multilayer Ceramic Capacitors (MLCC)

Description: A broad range of multilayer ceramic capacitors available in various sizes from 01005 to 2220, offering multiple dielectric types (C0G, X5R, X7R, X6S, Y5V, X7S, X7T) and rated voltages from 2.5 Vdc to 3 kVdc.

Operating Conditions:

  • Supply voltage: 2.5–3000 Vdc
  • Operating temperature: -55 to +125 °C (depending on dielectric)
  • Pulse (dv/dt) guarantee: 10,000 V/μs max. for 10,000 cycles (@Vr, Room temp)

Absolute Maximum Ratings:

  • Max supply voltage: 3 kVdc
  • Max junction/storage temperature: 125 °C

Key Specs:

  • Size range: 01005 (0402) to 2220 (5750)
  • Dielectric types: C0G, X5R, X7R, X6S, Y5V, X7S, X7T
  • Capacitance range: 0.5 pF to 220 μF
  • Capacitance tolerance: ±0.03 pF to -20, +80%
  • C0G temperature coefficient: 0±30 ppm/°C
  • X5R/X7R capacitance change: ±15%
  • Termination plating: Ni / Sn 100%

Features:

  • Wide selection of size: from 0402(Inch) to 2220(Inch)
  • Highly reliable tolerance and high speed automatic chip placement on PCBs
  • Wide capacitance range
  • Highly reliable performance
  • Highly resistant termination metal
  • Tape & reel for surface mount assembly

Applications:

  • Mobile Phone
  • DC - DC Converter
  • Tablet devices
  • PC (Laptop, Desktop)
  • HDD / SSD board
  • Display

Package:

  • 01005 (0402)
  • 0201 (0603)
  • 0402 (1005)
  • 0603 (1608)
  • 0805 (2012)
  • 1206 (3216)
  • 1210 (3225)
  • 1808 (4520)
  • 1812 (4532)
  • 2220 (5750)

Applications

Package Information

When designing printed circuit boards, the shape and size of the solder lands must allow for the proper amount of solder on the capacitor. The amount of solder at the end terminations has a direct effect on the probability that the chip will crack. The greater amount of solder, the larger amount of stress on the chip, and the more likely that it will break. Use the following illustrations as guidelines for proper Solder land design.

Related Variants

The following components are covered by the same datasheet.

Part NumberManufacturerPackage
CLSamsung electro-mechanics
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