CL32B226KOJNNNE
Multilayer Ceramic CapacitorThe CL32B226KOJNNNE is a multilayer ceramic capacitor from Samsung Electro-Mechanics. View the full CL32B226KOJNNNE datasheet below including key specifications.
Manufacturer
Samsung Electro-Mechanics
Category
Multilayer Ceramic Capacitor
Package
1210
Key Specifications
| Parameter | Value |
|---|---|
| Capacitance | 22uF |
| Temperature Coefficient | X7R |
| Tolerance | ±10% |
| Voltage Rating | 16V |
Overview
Part: CL Series — Samsung Electro-mechanics
Type: Multilayer Ceramic Capacitors (MLCC)
Description: A broad range of multilayer ceramic capacitors available in various sizes from 01005 to 2220, offering multiple dielectric types (C0G, X5R, X7R, X6S, Y5V, X7S, X7T) and rated voltages from 2.5 Vdc to 3 kVdc.
Operating Conditions:
- Supply voltage: 2.5–3000 Vdc
- Operating temperature: -55 to +125 °C (depending on dielectric)
- Pulse (dv/dt) guarantee: 10,000 V/μs max. for 10,000 cycles (@Vr, Room temp)
Absolute Maximum Ratings:
- Max supply voltage: 3 kVdc
- Max junction/storage temperature: 125 °C
Key Specs:
- Size range: 01005 (0402) to 2220 (5750)
- Dielectric types: C0G, X5R, X7R, X6S, Y5V, X7S, X7T
- Capacitance range: 0.5 pF to 220 μF
- Capacitance tolerance: ±0.03 pF to -20, +80%
- C0G temperature coefficient: 0±30 ppm/°C
- X5R/X7R capacitance change: ±15%
- Termination plating: Ni / Sn 100%
Features:
- Wide selection of size: from 0402(Inch) to 2220(Inch)
- Highly reliable tolerance and high speed automatic chip placement on PCBs
- Wide capacitance range
- Highly reliable performance
- Highly resistant termination metal
- Tape & reel for surface mount assembly
Applications:
- Mobile Phone
- DC - DC Converter
- Tablet devices
- PC (Laptop, Desktop)
- HDD / SSD board
- Display
Package:
- 01005 (0402)
- 0201 (0603)
- 0402 (1005)
- 0603 (1608)
- 0805 (2012)
- 1206 (3216)
- 1210 (3225)
- 1808 (4520)
- 1812 (4532)
- 2220 (5750)
Applications
Package Information
When designing printed circuit boards, the shape and size of the solder lands must allow for the proper amount of solder on the capacitor. The amount of solder at the end terminations has a direct effect on the probability that the chip will crack. The greater amount of solder, the larger amount of stress on the chip, and the more likely that it will break. Use the following illustrations as guidelines for proper Solder land design.
Related Variants
The following components are covered by the same datasheet.
| Part Number | Manufacturer | Package |
|---|---|---|
| CL | Samsung electro-mechanics | — |
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