CL21C331JCANNNC

Part: General Capacitors — Samsung Electro-mechanics

Type: Multilayer Ceramic Capacitor (MLCC)

Description: A range of general-purpose multilayer ceramic capacitors available in various EIA sizes from 0402 to 2220, offering wide capacitance and voltage ranges, and different temperature characteristics (C0G to Y5V).

Operating Conditions:

• Operating temperature: -55 to +125 °C (C0G, X7R, X7S, X7T), -55 to +105 °C (X6S), -30 to +85 °C (Y5V)
• Voltage range: 4V to 50V (dependent on specific part)

Absolute Maximum Ratings:

Key Specs:

• Capacitance tolerance: ±0.1 pF (B), ±0.25 pF (C), ±0.5 pF (D), ±1% (F), ±2% (G), ±5% (J), ±10% (K), ±20% (M), +80/-20% (Z)
• Temperature coefficient (C0G): 0 ± 30 ppm/°C
• Capacitance change (X5R): ±15% (-55 to +85 °C)
• Capacitance change (X7R): ±15% (-55 to +125 °C)
• Capacitance change (X6S): ±22% (-55 to +105 °C)
• Capacitance change (Y5V): -82 to +22% (-30 to +85 °C)
• Capacitance change (X7S): ±22% (-55 to +125 °C)
• Capacitance change (X7T): -33 to +22% (-55 to +125 °C)

Features:

• Wide selection of size: from 0402 to 2220
• Highly reliable tolerance and high speed automatic chip placement on PCBs
• Wide capacitance range
• Wide temperature compensation and voltage range: from C0G to Y5V and from 6.3V to 50V
• Highly reliable performance
• Highly resistant termination metal
• Tape & reel for surface mount assembly
• RoHS and REACH compliant

Applications:

• HHP, DSC, DVC, LCD, TV, Memory Module, PDA, Game Machine
• Tuner (Product code C is suitable)

Package:

• 0402 (1.00 x 0.50 mm)
• 0603 (1.60 x 0.80 mm)
• 0805 (2.00 x 1.25 mm)
• 1206 (3.20 x 1.60 mm)
• 1210 (3.20 x 2.50 mm)
• 1808 (4.50 x 2.00 mm)
• 1812 (4.50 x 3.20 mm)
• 2220 (5.70 x 5.00 mm)

When designing printed circuit boards, the shape and size of the solder lands must allow for the proper amount of solder on the capacitor. The amount of solder at the end terminations has a direct effect on the probability that the chip will crack. The greater amount of solder, the larger amount of stress on the chip, and the more likely that it will break. Use the following illustrations as guidelines for proper Solder land design.

Recommendation of solder Land Shape and Size