CL10C681JB8NNNC

Part: Multilayer Ceramic Capacitors (MLCCs) — Samsung Electro-mechanics

Type: Multilayer Ceramic Capacitor

Description: A broad range of Multilayer Ceramic Capacitors (MLCCs) offering a wide selection of sizes from 01005 to 2220, capacitance values from picofarads to microfarads, and voltage ratings from 4V to 2000V, with various dielectric types including C0G, X5R, X7R, X6S, Y5V, X7S, and X7T.

Operating Conditions:

• Supply voltage: 4V–2000V
• Operating temperature: -55 to +125 °C
• Capacitance tolerance: 0.1 pF to 0.5 pF, 1% to 20%, +80/-20%

Absolute Maximum Ratings:

• Max supply voltage: 2000 V
• Max junction/storage temperature: 125 °C

Key Specs:

• Capacitance range: 0.5 pF to 100 μF
• Voltage range: 4V, 6.3V, 10V, 16V, 25V, 35V, 50V, 100V, 200V, 350V, 500V, 1000V, 2000V
• Dielectric types: C0G, X5R, X7R, X6S, Y5V, X7S, X7T
• C0G Temperature Coefficient: 0 ± 30 ppm/°C
• X5R/X7R Capacitance Change: ±15% over operating temperature range
• X6S/X7S Capacitance Change: ±22% over operating temperature range
• Y5V Capacitance Change: +82/-22% over operating temperature range
• X7T Capacitance Change: +33/-22% over operating temperature range
• Available sizes: 01005 (0402) to 2220 (5750)

Features:

• RoHS Compliance and restriction of Br
• No use of materials breaking Ozone layer
• Wide selection of size: from 0402 to 2220
• Highly reliable tolerance and high speed automatic chip placement on PCBs
• Wide capacitance range
• Wide temperature compensation and voltage range
• Highly reliable performance
• Highly resistant termination metal
• Tape & reel for surface mount assembly

Applications:

• Desktop PC
• Note PC
• HHP
• DSC
• DVC
• LCD
• TV
• Memory Module
• PDA
• Game Machine
• Tuner
• DC-DC Converter

Package:

• 01005 (0402)
• 0201 (0603)
• 0402 (1005)
• 0603 (1608)
• 0805 (2012)
• 1206 (3216)
• 1210 (3225)
• 1808 (4520)
• 1812 (4532)
• 2220 (5750)
• Packaging options: Cardboard Tape (7', 10', 13' Reel), Embossed Type (7', 10', 13' Reel), Bulk, Bulk Case

5 = 0.50

mm

6 = 0.60

mm

8 = 0.80

mm

C = 0.85

mm

P = 1.15

mm

F,Q = 1.25

mm

H = 1.60

mm

J = 2.50

mm

When designing printed circuit boards, the shape and size of the solder lands must allow for the proper amount of solder on the capacitor. The amount of solder at the end terminations has a direct effect on the probability that the chip will crack. The greater amount of solder, the larger amount of stress on the chip, and the more likely that it will break. Use the following illustrations as guidelines for proper Solder land design.

Recommendation of solder Land Shape and Size