CC2640R2F

Part: CC2640R2F — Texas Instruments

Type: SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU

Description: A 2.4 GHz wireless microcontroller (MCU) supporting Bluetooth® 5.1 Low Energy and Proprietary 2.4 GHz applications, featuring an Arm® Cortex®-M3 core up to 48 MHz, 128 KB in-system programmable Flash, 20 KB ultra-low leakage SRAM, and an ultra-low power sensor controller.

Operating Conditions:

• Supply voltage: 1.8 to 3.8 V (Normal operation)
• External regulator mode: 1.7 to 1.95 V
• Operating temperature: -40 to +125 °C

Absolute Maximum Ratings:

Key Specs:

• CPU: Arm® Cortex®-M3, up to 48 MHz
• Flash Memory: 128 KB in-system programmable
• System SRAM: Up to 28 KB (20 KB ultra-low leakage)
• Sensor Controller SRAM: 2 KB ultra-low leakage
• Active-Mode RX Current: 5.9 mA
• Active-Mode TX Current (0 dBm): 6.1 mA
• Active-Mode MCU Current: 61 μA/MHz
• Standby Current: 1.1 μA (RTC running and RAM/CPU retention)
• Shutdown Current: 100 nA (wake up on external events)
• ADC: 12-bit, 200-ksamples/s, 8-channel analog MUX
• RF Transceiver Sensitivity (BLE): -97 dBm

Features:

• Ultra-low power sensor controller with 16-bit architecture
• Efficient code size architecture with drivers, TI-RTOS, and Bluetooth® software in ROM
• On-chip internal DC/DC converter
• UART, I2C, and I2S peripherals
• 2x SSI (SPI, MICROWIRE, TI)
• AES-128 security module and True Random Number Generator (TRNG)
• Integrated temperature sensor
• Supports over-the-air upgrade (OTA)

Applications:

• Home and Building Automation (connected appliances, lighting, smart locks, gateways, security systems)
• Industrial (factory automation, asset tracking and management, HMI, access control, EPOS, ESL)
• Health and Medical (electronic thermometers, SpO2, blood glucose/pressure monitors, weigh scales, hearing aids, patient monitors)
• Sports and Fitness (wearable fitness/activity monitors, smart trackers, fitness machines)
• HID (gaming, pointing devices)

Package:

• YFV DSBGA34 (2.7-mm × 2.7-mm)
• RSM VQFN32 (4-mm × 4-mm)
• RHB VQFN32 (5-mm × 5-mm)
• RGZ VQFN48 (7-mm × 7-mm)

• Microcontroller
• -Powerful Arm ® Cortex ® -M3
• -EEMBC CoreMark ® score: 142
• -Up to 48-MHz clock speed
• -275KB of nonvolatile memory including 128KB of in-system Programmable Flash
• -Up to 28KB of system SRAM, of which 20KB is ultra-low leakage SRAM
• -8KB of SRAM for cache or system RAM use
• -2-Pin cJTAG and JTAG debugging
• -Supports over-the-air upgrade (OTA)
• Ultra-low power sensor controller
• -Can run autonomous from the rest of the system
• -16-bit architecture
• -2KB of ultra-low leakage SRAM for code and data
• Efficient code size architecture, placing drivers, TI-RTOS, and Bluetooth ® software in ROM to make more Flash available for the application
• RoHS-compliant packages
• -2.7-mm × 2.7-mm YFV DSBGA34 (14 GPIOs)
• -4-mm × 4-mm RSM VQFN32 (10 GPIOs)
• -5-mm × 5-mm RHB VQFN32 (15 GPIOs)
• -7-mm × 7-mm RGZ VQFN48 (31 GPIOs)
• Peripherals
• -All digital peripheral pins can be routed to any GPIO
• -Four general-purpose timer modules (eight 16-bit or four 32-bit timers, PWM each)
• -12-bit ADC, 200-ksamples/s, 8-channel analog MUX
• -Continuous time comparator
• -Ultra-low power analog comparator
• -Programmable current source
• -UART, I2C, and I2S
• -2× SSI (SPI, MICROWIRE, TI)
• -Real-Time Clock (RTC)
• -AES-128 security module
• -True Random Number Generator (TRNG)
• -Support for eight capacitive-sensing buttons
• -Integrated temperature sensor

• Home and Building Automation
• -Connected appliances
• -Lighting
• -Smart locks
• -Gateways
• -Security Systems
• Industrial
• -Factory automation
• -Asset tracking and management

Tc = 25°C, VDDS = 3.0 V and voltage scaling enabled, unless otherwise noted. (1)

Tc = 25°C, VDDS = 3.0 V and voltage scaling enabled, unless otherwise noted. (1)

over operating free-air temperature range (unless otherwise noted) (1) (2)

over operating free-air temperature range (unless otherwise noted)

• (2) These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RθJC] value, which is based on a JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these EIA/ JEDEC standards:
• JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air) .
• JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages .
• JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages .
• JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements .

For RSM, RHB, and RGZ, power dissipation of 2 W and an ambient temperature of 70°C is assumed. For YFV, power dissipation of 1.3 W and ambient temperature of 25°C is assumed.

Very few external components are required for the operation of the CC2640R2F device. This section provides some general information about the various configuration options when using the CC2640R2F in an application, and then shows two examples of application circuits with schematics and layout. This is only a small selection of the many application circuit examples available as complete reference designs from the product folder on www.ti.com.

Figure 10-1 shows the various RF front-end configuration options. The RF front end can be used in differentialor single-ended configurations with the options of having internal or external biasing. These options allow for various trade-offs between cost, board space, and RF performance. Differential operation with external bias gives the best performance while single-ended operation with internal bias gives the least amount of external components and the lowest power consumption. Reference designs exist for each of these options.

Figure 10-1 shows the various RF front-end configuration options. The RF front end can be used in differentialor single-ended configurations with the options of having internal or external biasing. These options allow for various trade-offs between cost, board space, and RF performance. Differential operation with external bias gives the best performance while single-ended operation with internal bias gives the least amount of external components and the lowest power consumption. Reference designs exist for each of these options.

Copyright © 2016, Texas Instruments Incorporated

Figure 10-1. CC2640R2F Application Circuit

Figure 10-2. Supply Voltage Configurations

Figure 10-2 shows the various supply voltage configuration options. Not all power supply decoupling capacitors or digital I/Os are shown. Exact pin positions will vary between the different package options. For a detailed overview of power supply decoupling and wiring, see the TI reference designs and the CC26xx technical reference manual (Section 11.3).

Figure 10-2 shows the various supply voltage configuration options. Not all power supply decoupling capacitors or digital I/Os are shown. Exact pin positions will vary between the different package options. For a detailed overview of power supply decoupling and wiring, see the TI reference designs and the CC26xx technical reference manual (Section 11.3).

Copyright © 2016, Texas Instruments Incorporated

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