CC1352P7RGZ
CC1352P7 SimpleLink™ High-Performance Multi-Band Wireless MCU With Integrated Power Amplifier
Manufacturer
Texas Instruments
Overview
Part: CC1352P7 from Texas Instruments
Type: High-Performance Multi-Band Wireless MCU With Integrated Power Amplifier
Key Specs:
- Processor: 48-MHz Arm Cortex-M4F
- Flash Memory: 704KB
- SRAM: 144KB ultra-low leakage
- Operating Voltage: 1.8-V to 3.8-V
- Operating Temperature: -40 to +105°C
- Max Output Power: +20 dBm
- RX Sensitivity: -121 dBm for 2.5-kbps long-range mode
Features:
- Dual-band Sub-1 GHz and 2.4 GHz operation
- Dynamic multiprotocol manager (DMM) driver
- Programmable radio supporting 2-(G)FSK, 4-(G)FSK, MSK, OOK, Bluetooth 5.2 Low Energy, IEEE 802.15.4 PHY and MAC
- Over-the-air upgrade (OTA) support
- Ultra-low power sensor controller with 4KB of SRAM
- Low power consumption (e.g., 0.8 μA standby mode with RTC, 144KB RAM)
- Wireless protocol support for Thread, Zigbee, Matter, Bluetooth 5.2 Low Energy, Wi-SUN, mioty, Amazon Sidewalk, Wireless M-Bus, SimpleLink TI 15.4-stack, 6LoWPAN
- High performance radio with output power up to +20 dBm
- MCU peripherals including 12-bit ADC, 8-bit DAC, timers, UART, SSI, I2C, I2S, RTC
- Security enablers: AES 128/256-bit, ECC, RSA, SHA2 accelerators, True random number generator (TRNG)
- On-chip buck DC/DC converter
Applications:
- Grid infrastructure (Smart Meters, Grid communications, EV charging, Alternative energy)
- Building automation (Building security systems, HVAC systems, Fire safety)
- Retail Automation (Electronic shelf labels, Portable POS terminal)
- Personal Electronics (RF remote controls, Smart Speakers, Smart Displays, Set-top box, Gaming, Electronic and robotic toys, Wearables, Smart trackers, Smart clothing, Smartwatch)
- Wireless Modules (Bluetooth Low Energy, Thread, Zigbee, Matter, Wi-SUN, Amazon Sidewalk, mioty, multiprotocol)
Package:
- 7-mm × 7-mm RGZ VQFN48 (26 GPIOs)
Applications
- Grid infrastructure
- Smart Meters – electricity meter, water meter, gas meter and heat cost allocator
- Grid communications – wireless communications
- EV charging infrastructure AC charging (pile) station
- Other alternative energy – energy harvesting
- Building automation
- Building security systems – motion detector, door and window sensor, glass break detector, panic button, electronic smart lock and IP network camera
- HVAC systems thermostat, environmental sensor andHVAC controller
- Fire safety smoke and head detector, gas detector and fire alarm control panel
- Retail Automation
- Retail automation & payment applications – electronic shelf labels and portable POS terminal
- Personal Electronics
- Wireless Modules
- Wireless third party modules including Bluetooth Low Energy, Thread, Zigbee, Matter, Wi-SUN®, Amazon Sidewalk, mioty® and multiprotocol
- Wireless communications modules
Electrical Characteristics
Measurements CBSed to PG2.1:
| PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT |
|---|---|---|---|---|---|
| Offset error | V_REF = V_DDS = 3.8 V | ±0.40 | LSB⁽¹⁾ | ||
| V_REF = V_DDS = 3.0 V | ±0.50 | ||||
| V_REF = V_DDS = 1.8 V | ±0.75 | ||||
| V_REF = DCOUPL, pre-charge ON | ±1.55 | ||||
| V_REF = DCOUPL, pre-charge OFF | ±1.30 | ||||
| V_REF = ADCREF | ±1.10 | ||||
| Max code output voltage variation | V_REF = V_DDS = 3.8 V | ±1.00 | LSB⁽¹⁾ | ||
| V_REF = V_DDS = 3.0 V | ±1.00 | ||||
| V_REF = V_DDS = 1.8 V | ±1.00 | ||||
| V_REF = DCOUPL, pre-charge ON | ±3.45 | ||||
| V_REF = DCOUPL, pre-charge OFF | ±2.10 | ||||
| V_REF = ADCREF | ±1.90 | ||||
| Output voltage range Load = Low Power Clocked Comparator | V_REF = V_DDS = 3.8 V, code 1 | 0.03 | V | ||
| V_REF = V_DDS = 3.8 V, code 255 | 3.61 | ||||
| V_REF = V_DDS = 3.0 V, code 1 | 0.02 | ||||
| V_REF = V_DDS = 3.0 V, code 255 | 2.85 | ||||
| V_REF = V_DDS = 1.8 V, code 1 | 0.02 | ||||
| V_REF = V_DDS = 1.8 V, code 255 | 1.71 | ||||
| V_REF = DCOUPL, pre-charge OFF, code 1 | 0.02 | ||||
| V_REF = DCOUPL, pre-charge OFF, code 255 | 1.20 | ||||
| V_REF = DCOUPL, pre-charge ON, code 1 | 1.27 | ||||
| V_REF = DCOUPL, pre-charge ON, code 255 | 2.46 | ||||
| V_REF = ADCREF, code 1 | 0.02 | ||||
| V_REF = ADCREF, code 255 | 1.42 |
Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1) (2)
| MIN | MAX | UNIT | |||
|---|---|---|---|---|---|
| VDDS(3) | Supply voltage | -0.3 | 4.1 | V | |
| Voltage on any digital pin(4) | -0.3 | VDDS + 0.3, max 4.1 | V | ||
| Voltage on crystal oscillator pins, X32K_Q1, X32K_Q2, X48M_N and X48M_P | -0.3 | VDDR + 0.3, max 2.25 | V | ||
| Vin | Voltage on ADC input | Voltage scaling enabled | -0.3 | VDDS | V |
| Voltage scaling disabled, internal reference | -0.3 | 1.49 | V | ||
| Voltage scaling disabled, VDDS as reference | -0.3 | VDDS / 2.9 | V | ||
| Input level, Sub-1 GHz RF pins (RF_P_SUB_1GHZ and RF_N_SUB_1GHZ) | 10 | dBm | |||
| Input level, 2.4 GHz RF pins (RF_P_2_4GHZ and RF_N_2_4GHZ) | 5 | dBm | |||
| Tstg | Storage temperature | -40 | 150 | °C |
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to ground, unless otherwise noted.
(3) VDDS_DCDC, VDDS2 and VDDS3 must be at the same potential as VDDS.
(4) Including analog capable DIOs.
Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
| MIN | MAX | UNIT | ||
|---|---|---|---|---|
| Operating ambient temperature(1) (3) | –40 | 105 | °C | |
| Operating junction temperature(1) (3) | –40 | 115 | °C | |
| Operating supply voltage (VDDS) | 1.8 | 3.8 | V | |
| Operating supply voltage (VDDS), boost mode | VDDR = 1.95 V +14 dBm RF output sub-1 GHz power amplifier | 2.1 | 3.8 | V |
| Rising supply voltage slew rate | 0 | 100 | mV/μs | |
| Falling supply voltage slew rate(2) | 0 | 20 | mV/μs |
(1) Operation at or near maximum operating temperature for extended durations will result in a reduction in lifetime.
(2) For small coin-cell batteries, with high worst-case end-of-life equivalent source resistance, a 22-μF VDDS input capacitor must be used to ensure compliance with this slew rate.
(3) For thermal resistance characteristics refer to Section 7.8.
Thermal Information
| THERMAL METRIC(1) | Description | RGZ (VQFN) 48 PINS | UNIT |
|---|---|---|---|
| RθJA | Junction-to-ambient thermal resistance | 23.7 | °C/W(2) |
| RθJC(top) | Junction-to-case (top) thermal resistance | 13.0 | °C/W(2) |
| RθJB | Junction-to-board thermal resistance | 7.7 | °C/W(2) |
| ψJT | Junction-to-top characterization parameter | 0.1 | °C/W(2) |
| ψJB | Junction-to-board characterization parameter | 7.6 | °C/W(2) |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 1.9 | °C/W(2) |
(1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.
(2) °C/W = degrees Celsius per watt.
Related Variants
The following components are covered by the same datasheet.
| Part Number | Manufacturer | Package |
|---|---|---|
| CC1352P7 | Texas Instruments | — |
| CC1352P7-1 | Texas Instruments | — |
| CC1352P7-4 | Texas Instruments | — |
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