CC1352P7RGZ
The CC1352P7RGZ is an electronic component from Texas Instruments. View the full CC1352P7RGZ datasheet below including electrical characteristics, absolute maximum ratings.
Manufacturer
Texas Instruments
Overview
Part: CC1352P7 — Texas Instruments
Type: High-Performance Multi-Band Wireless MCU With Integrated Power Amplifier
Description: A multiprotocol and multi-band Sub-1 GHz and 2.4-GHz wireless microcontroller (MCU) with a 48-MHz Arm Cortex-M4F processor, 704KB flash, 144KB SRAM, and an integrated +20 dBm power amplifier, optimized for low-power wireless communication and advanced sensing.
Operating Conditions:
- Supply voltage: 1.8-V to 3.8-V
- Operating temperature: -40 to +105°C
- Main processor clock: 48 MHz
Absolute Maximum Ratings:
Key Specs:
- Main processor: 48-MHz Arm Cortex-M4F
- Flash memory: 704KB
- SRAM: 144KB (ultra-low leakage with parity)
- Sub-1 GHz frequency bands: 287 to 351-MHz, 359 to 527-MHz, 861 to 1054-MHz, 1076 to 1315-MHz
- 2.4 GHz frequency band: 2360 to 2500-MHz
- RX current (868 MHz): 5.4 mA
- TX current (+20 dBm at 2.4 GHz): 101 mA
- Standby mode current: 0.8 μA (RTC, 144KB RAM)
- ADC: 12-bit, 200 kSamples/s, 8 channels
Features:
- Dual-band Sub-1 GHz and 2.4 GHz operation
- Dynamic multiprotocol manager (DMM) driver
- Integrated power amplifier with up to +20 dBm output
- Ultra-low power sensor controller with 4KB SRAM
- Hardware cryptographic accelerators (AES 128/256, ECC, RSA, SHA2, TRNG)
- Peripherals: UART, SSI, I2C, I2S, Timers, ADC, DAC, Comparators, RTC
- Supports Thread, Zigbee, Matter, Bluetooth 5.2 Low Energy, Wi-SUN, mioty, Amazon Sidewalk, Wireless M-Bus, 6LoWPAN
Applications:
- Grid infrastructure (Smart Meters, Grid communications, EV charging)
- Building automation (Security systems, HVAC, Fire safety)
- Retail automation (Electronic shelf labels, Portable POS)
- Personal electronics (RF remote controls, Smart Speakers, Wearables)
- Wireless Modules
Package:
- RGZ VQFN48 (7-mm × 7-mm)
Applications
- Grid infrastructure
- -Smart Meters - electricity meter, water meter, gas meter and heat cost allocator
- -Grid communications - wireless communications
- -EV charging infrastructure - AC charging (pile) station
- -Other alternative energy - energy harvesting
- Building automation
- -Building security systems - motion detector, door and window sensor, glass break detector, panic button, electronic smart lock and IP network camera
- -HVAC systems - thermostat, environmental sensor andHVAC controller
- -Fire safety - smoke and head detector, gas detector and fire alarm control panel
Electrical Characteristics
Measurements CBSed to PG2.1:
| PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT |
|---|---|---|---|---|---|
| T A = 25 °C, V DDS = 1.8 V | |||||
| GPIO VOH at 8 mA load | IOCURR = 2, high-drive GPIOs only | 1.56 | V | ||
| GPIO VOL at 8 mA load | IOCURR = 2, high-drive GPIOs only | 0.24 | V | ||
| GPIO VOH at 4 mA load | IOCURR = 1 | 1.59 | V | ||
| GPIO VOL at 4 mA load | IOCURR = 1 | 0.21 | V | ||
| GPIO pullup current | Input mode, pullup enabled, Vpad = 0 V | 73 | μA | ||
| GPIO pulldown current | Input mode, pulldown enabled, Vpad = VDDS | 19 | μA | ||
| GPIO low-to-high input transition, with hysteresis | IH = 1, transition voltage for input read as0→1 | 1.08 | V | ||
| GPIO high-to-low input transition, with hysteresis | IH = 1, transition voltage for input read as1→0 | 0.73 | V | ||
| GPIO input hysteresis | IH = 1, difference between0→1 and 1 →0points | 0.35 | V | ||
| T A = 25 °C, V DDS = 3.0 V | |||||
| GPIO VOH at 8 mA load | IOCURR = 2, high-drive GPIOs only | 2.59 | V | ||
| GPIO VOL at 8 mA load | IOCURR = 2, high-drive GPIOs only | 0.42 | V | ||
| GPIO VOH at 4 mA load | IOCURR = 1 | 2.63 | V | ||
| GPIO VOL at 4 mA load | IOCURR = 1 | 0.4 | V | ||
| T A = 25 °C, V DDS = 3.8 V | |||||
| GPIO pullup current | Input mode, pullup enabled, Vpad = 0 V | 282 | μA | ||
| GPIO pulldown current | Input mode, pulldown enabled, Vpad = VDDS | 110 | μA | ||
| GPIO low-to-high input transition, with hysteresis | IH = 1, transition voltage for input read as0→1 | 1.97 | V | ||
| GPIO high-to-low input transition, with hysteresis | IH = 1, transition voltage for input read as1→0 | 1.55 | V | ||
| GPIO input hysteresis | IH = 1, difference between0→1 and 1 →0points | 0.42 | V | ||
| T A = 25 °C | |||||
| VIH | Lowest GPIO input voltage reliably interpreted as a High | 0.8*V DDS | V | ||
| VIL | Highest GPIO input voltage reliably interpreted as a Low | 0.2*V DDS | V |
Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1) (2)
| MIN | MAX | UNIT | ||
|---|---|---|---|---|
| VDDS (3) | Supply voltage | -0.3 | 4.1 | V |
| Voltage on any digital pin (4) | -0.3 | VDDS + 0.3, max 4.1 | V | |
| Voltage on crystal oscillator pins, X32K_Q1, X32K_Q2, X48M_N and X48M_P | -0.3 | VDDR + 0.3, max 2.25 | V | |
| in | Voltage on ADC Voltage scaling enabled | -0.3 | VDDS | V |
| V | input Voltage scaling disabled, internal reference | -0.3 | 1.49 | V |
| Voltage scaling disabled, VDDS as reference | -0.3 | VDDS / 2.9 | V | |
| Input level, Sub-1 GHz RF pins (RF_P_SUB_1GHZ and RF_N_SUB_1GHZ) | 10 | dBm | ||
| Input level, 2.4 GHz RF pins (RF_P_2_4GHZ and RF_N_2_4GHZ) | 5 | dBm | ||
| T stg | Storage temperature | -40 | 150 | °C |
- (2) All voltage values are with respect to ground, unless otherwise noted.
- (3) VDDS_DCDC, VDDS2 and VDDS3 must be at the same potential as VDDS.
(4) Including analog capable DIOs.
Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
| MIN | MAX | UNIT | ||
|---|---|---|---|---|
| Operating ambient temperature (1) (3) | Operating ambient temperature (1) (3) | -40 | 105 | °C |
| Operating junction temperature (1) (3) | Operating junction temperature (1) (3) | -40 | 115 | °C |
| Operating supply voltage (VDDS) | Operating supply voltage (VDDS) | 1.8 | 3.8 | V |
| Operating supply voltage (VDDS), boost mode | VDDR = 1.95 V +14 dBm RF output sub-1 GHz power amplifier | 2.1 | 3.8 | V |
| Rising supply voltage slew rate | Rising supply voltage slew rate | 0 | 100 | mV/μs |
| Falling supply voltage slew rate (2) | Falling supply voltage slew rate (2) | 0 | 20 | mV/μs |
Thermal Information
| THERMAL | METRIC (1) | PACKAGE RGZ (VQFN) | UNIT |
|---|---|---|---|
| 48 PINS | |||
| R θJA | Junction-to-ambient thermal resistance | 23.7 | °C/W (2) |
| R θJC(top) | Junction-to-case (top) thermal resistance | 13.0 | °C/W (2) |
| R θJB | Junction-to-board thermal resistance | 7.7 | °C/W (2) |
| ψ JT | Junction-to-top characterization parameter | 0.1 | °C/W (2) |
| ψ JB | Junction-to-board characterization parameter | 7.6 | °C/W (2) |
| R θJC(bot) | Junction-to-case (bottom) thermal resistance | 1.9 | °C/W (2) |
Related Variants
The following components are covered by the same datasheet.
| Part Number | Manufacturer | Package |
|---|---|---|
| CC1352P7 | Texas Instruments | — |
| CC1352P7-1 | Texas Instruments | — |
| CC1352P7-4 | Texas Instruments | — |
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