BQ25180YBGR.A
Table of Contents
Manufacturer
Texas Instruments
Category
Integrated Circuits (ICs)
Overview
Part: BQ25180, Texas Instruments
Type: I2C Controlled, 1-Cell, 1-A Linear Battery Charger with Power Path and Ship Mode
Key Specs:
- Input Voltage Operating Range: 3.0 V to 5.9 V
- Input Voltage Tolerance: 25 V
- Fast Charge Current: 5 mA to 1 A
- Discharge Current: Up to 2.5 A
- Shutdown Mode Quiescent Current: 15 nA
- Battery Regulation Voltage Accuracy: 0.5%
Features:
- 1-A Power path linear battery charger
- Power path management for powering the system and charging the battery
- Ultra low quiescent current modes (15-nA Shutdown, 3.2-μA Ship, 3-μA Battery Only)
- One push-button wake-up and reset input
- Integrated fault protection (Input OVP, Battery UVLO, Battery short, Battery OCP, Thermal regulation)
Applications:
- TWS headset and charging case
- Smart glasses, AR and VR
- Smart watches and other wearable devices
- Retail automation and payment
- Building automation
Package:
- DSBGA (8): 1.6 mm x 1.1 mm
Features
- 1-A Power path linear battery charger
- 3.0-V to 5.9-V input voltage operating range optimized for battery to battery charging and USB adapter
- 25-V tolerant input voltage
- Configurable battery regulation voltage with 0.5% accuracy from 3.6 V to 4.65 V in 10-mV steps
- 5-mA to 1-A configurable fast charge current
- 55-mΩ battery FET ON resistance
- Up to 2.5-A discharge current to support high system loads
- Configurable termination current down to 0.5 mA
- Configurable NTC charging profile thresholds including JEITA support
- Power cycle and advanced reset mechanisms to recover system
- Power path management for powering the system and charging the battery
- Regulated system voltage (SYS) ranging from 4.4 V to 4.9 V in addition to battery voltage tracking and input pass-though options
- Configurable input current limit
- Selectable adapter or battery power for system
- Dynamic power path management optimizes charging from weak adapters
- Ultra low quiescent current modes
- 15-nA Shutdown mode
- 3.2-μA Ship mode with button press wake
- 3 μA in Battery Only mode
- 30-μA input adapter Iq in Sleep mode
- One push-button wake-up and reset input
- Integrated fault protection
- Input overvoltage protection (VIN_OVP)
- Battery undervoltage protection (VBUVLO)
- Battery short protection (BATSC)
- Battery overcurrent protection (BATOCP)
- Input current limit protection (ILIM)
- Thermal regulation (TREG) and thermal shutdown (TSHUT)
- Battery thermal fault protection (TS)
- Watchdog and safety timer fault
- System short protection
- System overvoltage protection
Applications
Pin Configuration
Figure 6-1. YBG Package 8-Pin DSBGA (Top View)
Table 6-1. Pin Functions
| PIN | I/O(1) | DESCRIPTION | |
|---|---|---|---|
| NAME | NO. | ||
| IN | A2 | P | DC Input Power Supply. IN is connected to the external DC supply. Bypass IN to GND with at least 1 µF of capacitance using a ceramic capacitor. |
| SYS | B2 | P | Regulated System Output. Connect at least 10-µF ceramic capacitor (at least >1 µF of ceramic capacitance with DC bias derating) from SYS to GND as close to the SYS and GND pins as possible. |
| BAT | C2 | P | Battery Connection. Connect to the positive terminal of the battery. Bypass BAT to GND with at least 1 µF of ceramic capacitance. |
| GND | D2 | - | Ground connection. Connect to the ground plane of the circuit. |
| SCL | B1 | I/O | I²C Interface Clock. Connect SCL to the logic rail through a 10-kΩ pullup resistor. |
| SDA | C1 | I/O | I²C Interface Data. Connect SDA to the logic rail through a 10-kΩ pullup resistor. |
| /INT | A1 | O | INT is an open-drain output that signals fault interrupts. When a fault occurs, a 128-µs active low pulse is sent out as an interrupt for the host. INT is enabled/disabled using the MASK_INT bit in the control register. Can be pulled up to the logic rail through a 1-kΩ to 20-kΩ resistor. |
| TS/MR | D1 | I/O | Manual Reset Input/ NTC thermistor pin. TS/MR is a general purpose input that must be held low for greater than tLPRESS to go into Ship mode or perform a hardware reset. It can also be used to detect shorter button press durations such as tWAKE1 and tWAKE2. TS/MR may be driven by a momentary push-button or a MOS switch. The TSMR pin can also have an NTC thermistor connected on to it. |
Electrical Characteristics
VIN = 5V, VBAT = 3.6V. -40°C < TJ < 125°C unless otherwise noted. Typical data at TJ = 25°C
| PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | |
|---|---|---|---|---|---|---|
| INPUT CURRENTS | ||||||
| IQ_IN | Input supply quiescent current | VBAT = 3.6V, VIN = 5V, Charge enabled, ICHG = 0mA, SYSREG = 4.5V | 0.75 | 1 | mA | |
| IQ_IN | Input supply quiescent current | VBAT = 3.6V, VIN = 5V, Charge enabled, ICHG = 0mA, SYSREG = Passthrough | 0.660 | 0.850 | mA | |
| ISLEEP_IN | SLEEP input current | VIN = 3.6V, VBAT = 3.7V | 30 | μA | ||
| IQ_BAT | Battery quiescent current | VIN <vuvlo floating,="" or="" watchdog<br="">disabled, Push button disabled, I2C functional. VBAT =3.6V TJ = 25°C | 3 | 3.5 | μA | |
| IQ_BAT | Battery quiescent current | VIN <vuvlo ,="" push-button<br="" vbat="3.6V,">function enabled, 0°C < TJ < 85°C | 4 | 5 | μA | |
| IBAT_SHUT DOWN | Battery discharge current in Ship Mode | VIN = 0V, Ship Mode, VBAT = 3.6V, Adapter Sense wake enabled. | 15 | nA | ||
| IBAT_SHIP | Battery discharge current in Ship Mode POWER-PATH MANAGEMENT AND INPUT | VBAT = 3.6V, Push button function enabled (average current), 0°C < TJ < 85°C | 3.2 | 4.5 | μA | |
| VIN_OP | Input voltage operating range | 3 | 5.5 | V | ||
| VIN_UVLO Z | Exit IN undervoltage lock-out | IN rising | 3 | V | ||
| VIN_UVLO | Enter IN undervoltage lock-out | IN falling | 2.7 | V | ||
| VIN_LOWV | IN voltage to start charging | IN rising | 3 | 3.15 | V | |
| VIN_LOWV Z | IN voltage to stop charging | IN falling | 2.95 | 3.1 | V | |
| VIN_PORZ | IN voltage threshold to enter shipmode | IN falling | 1.09 | 1.3 | 1.66 | V |
| VSLEEPZ | Exit sleep mode threshold | IN rising, VIN - VBAT, VBAT= 4V | 100 | 135 | 185 | mV |
| VSLEEP | Sleep mode threshold hysteresis | IN falling, VIN - VBAT, VBAT= 4V | 72 | mV | ||
| VIN_OVP | VIN overvoltage rising threshold | IN rising | 5.5 | 5.7 | 5.9 | V |
| VIN_OV_H YS | IN overvoltage hysteresis | IN falling VBAT = 3.6V, IBAT_OCP= 00 | 125 0.5 | mV A | ||
| IBAT_OCP | BATOCP(Reverse OCP only) | VBAT = 3.6V, IBAT_OCP= 01 VBAT = 3.6V, IBAT_OCP= 10 VBAT = 3.6V, IBAT_OCP= 11 | 1 1.5 Disabled | A A A | ||
| VBSUP1 | Enter supplement mode threshold | VBAT = 3.6V, VBAT > VBUVLO, VSYS< VBAT-VBSUP1 | 40 | mV | ||
| VBSUP2 | Exit supplement mode threshold | VBAT > VBUVLO, VSYS>VBAT-VBSUP2 | 20 | mV |
Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
| MIN | MAX | UNIT | ||
|---|---|---|---|---|
| Input Voltage | IN | -0.3 | 25 | V |
| Voltage | All other pins | -0.3 | 5.5 | V |
| Input Current (DC) | IN | 1.1 | A | |
| SYS Discharge Current(DC) | SYS | 1.5 | A | |
| SYS Discharge Current (tpulse <20ms) | SYS | 2.5 | A | |
| Output Sink Current | /INT | 20 | mA | |
| TJ | Junction temperature | -40 | 150 | °C |
| Tstg | Storage temperature | -65 | 150 | °C |
(1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
| MIN | NOM | MAX | UNIT | ||
|---|---|---|---|---|---|
| VBAT | Battery Voltage Range | 2.2 | 4.6 | V | |
| VIN | Input Voltage Range | 2.7 | 5.5 | V |
Copyright © 2023 Texas Instruments Incorporated Submit Document Feedback 5
Thermal Information
| BQ25180 | UNIT | ||
|---|---|---|---|
| THERMAL METRIC | YBG (DSBGA) 8 PIN | ||
| RθJA | Junction-to-ambient thermal resistance (EVM(2)) | 65 | °C/W |
| RθJA | Junction-to-ambient thermal resistance (JEDEC(1)) | 107.1 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 0.9 | °C/W |
| RθJB | Junction-to-board thermal resistance | 30.3 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 0.3 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 30.3 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | °C/W |
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
(2) 1oz Copper, 2-layer board
Related Variants
The following components are covered by the same datasheet.
| Part Number | Manufacturer | Package |
|---|---|---|
| BQ25180 | Texas Instruments | — |
| BQ25180YBGR | Texas Instruments | 8-XFBGA, DSBGA |
Data on this page is extracted from publicly available manufacturer datasheets using automated tools including AI. It may contain errors or omissions. Always verify specifications against the official manufacturer datasheet before making design or purchasing decisions. See our Terms of Service. Rights holders can submit a takedown request.
Get structured datasheet data via API
Get started free