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BMI160

Inertial Measurement Unit

The BMI160 is a inertial measurement unit from Bosch Sensortec. View the full BMI160 datasheet below including key specifications, pinout, absolute maximum ratings.

Manufacturer

Bosch Sensortec

Category

Inertial Measurement Unit

Package

14-VFLGA Module

Lifecycle

Obsolete

Key Specifications

ParameterValue
Mounting TypeSurface Mount
Operating Temperature-40°C ~ 85°C
Output TypeI2C, SPI
Package / Case14-VFLGA Module
Sensor TypeAccelerometer, Gyroscope, 6 Axis
Supplier Device Package14-LGA (2.5x3)

Overview

Part: BMI160 — Bosch Sensortec

Type: Inertial Measurement Unit (IMU)

Description: A highly integrated, low power inertial measurement unit (IMU) that provides precise 16-bit triaxial acceleration and 16-bit triaxial angular rate (gyroscopic) measurement, with a typical power consumption of 925 μA in full operation.

Operating Conditions:

  • Supply voltage: 1.71V–3.6V (VDD), 1.2V–3.6V (VDDIO)
  • I2C clock frequency: up to 1 MHz (extended mode)

Key Specs:

  • Accelerometer resolution: 16-bit
  • Gyroscope resolution: 16-bit
  • Typical power consumption (accel and gyro in full operation): 925 μA
  • FIFO buffer size: 1024 bytes
  • Sensor timestamp resolution: 39 μs
  • Step detector/counter power consumption: 5 μA each

Features:

  • High performance accelerometer and gyroscope (hardware synchronized)
  • Very low power consumption: typ. 925 μA (accelerometer and gyroscope in full operation)
  • Android Lollipop compatible: significant motion and step detector / step counter (5 μA each)
  • Very small 2.5 x 3.0 mm² footprint, height 0.83 mm
  • Built-in power management unit (PMU) for advanced power management
  • Power saving with fast start-up mode of gyroscope
  • Wide power supply range: 1.71V … 3.6V
  • Allocatable FIFO buffer of 1024 bytes (capable of handling external sensor data)
  • Hardware sensor time-stamps for accurate sensor data fusion
  • Integrated interrupts for enhanced autonomous motion detection
  • Flexible digital primary interface to connect to host over I2C or SPI
  • Extended I2C mode with clock frequencies up to 1 MHz
  • Additional secondary high speed interface for OIS application
  • Capable of handling external sensor data (e.g. geomagnetic or barometric pressure sensors by Bosch Sensortec)

Applications:

  • Augmented Reality
  • Indoor navigation
  • 3D scanning / indoor mapping
  • Advanced gesture recognition
  • Immersive gaming
  • 9-axis motion detection
  • Air mouse applications and pointers
  • Pedometer / step counting
  • Advanced system power management for mobile applications
  • Optical image stabilization of camera modules
  • Free-fall detection and warranty logging

Package:

  • 14-pin LGA (2.5 × 3.0 × 0.83 mm³)

Features

  • High performance accelerometer and gyroscope (hardware synchronized)
  • Very low power consumption: typ. 925 μA (accelerometer and gyroscope in full operation)
  • Android Lollipop compatible: significant motion and step detector / step counter (5 μA each)
  • Very small 2.5 x 3.0 mm 2 footprint, height 0.83 mm
  • Built-in power management unit (PMU) for advanced power management
  • Power saving with fast start-up mode of gyroscope
  • Wide power supply range: 1.71V … 3.6V
  • Allocatable FIFO buffer of 1024 bytes (capable of handling external sensor data)
  • Hardware sensor time-stamps for accurate sensor data fusion
  • Integrated interrupts for enhanced autonomous motion detection
  • Flexible digital primary interface to connect to host over I 2 C or SPI
  • Extended I 2 C mode with clock frequencies up to 1 MHz
  • Additional secondary high speed interface for OIS application
  • Capable of handling external sensor data
  • (e.g. geomagnetic or barometric pressure sensors by Bosch Sensortec)

Applications

  • Augmented Reality
  • Indoor navigation
  • 3D scanning / indoor mapping
  • Advanced gesture recognition
  • Immersive gaming
  • 9-axis motion detection
  • Air mouse applications and pointers
  • Pedometer / step counting
  • Advanced system power management for mobile applications
  • Optical image stabilization of camera modules
  • Free-fall detection and warranty logging

Pin Configuration

BMI160 Pinout — 14-VFLGA Package

Pin NumberPin NameTypeDescription
1VDDIOPI/O Supply Voltage (1.2V to 3.6V)
2CSBIChip Select / I2C Address Select
3SDOI/OSPI Data Output / I2C Address Select
4SDA/SDII/OI2C Data / SPI Data Input
5SCL/SCKII2C Clock / SPI Clock
6GNDPGround
7INT2OInterrupt Output 2
8INT1OInterrupt Output 1
9VDDIOPI/O Supply Voltage (1.2V to 3.6V)
10OIS_ENIOIS Enable (Secondary Interface)
11OIS_CLKIOIS Clock (Secondary Interface)
12OIS_DAI/OOIS Data (Secondary Interface)
13VDDPCore Supply Voltage (1.71V to 3.6V)
14GNDPGround

Notes

  • Power pins: VDD (pin 13) powers the internal core; VDDIO (pins 1, 9) powers the I/O domain. Both must be within specification for proper operation.
  • Primary Interface: Pins 2–5 support either I2C (SDA/SCL on pins 4–5, CSB and SDO tied appropriately) or SPI (4-wire or 3-wire mode).
  • Secondary Interface: Pins 10–12 support OIS (Optical Image Stabilization) in SPI mode or can be used for secondary I2C magnetometer interface.
  • Interrupt outputs: INT1 and INT2 (pins 8, 7) are configurable for various motion and data-ready events.
  • Ground: Pins 6 and 14 must be connected to ground.

Absolute Maximum Ratings

Table 5: Absolute maximum ratings

ParameterConditionMinMaxUnits
Voltage at Supply PinV DD Pin-0.34.25V
Voltage at Supply PinV DDIO Pin-0.34.25V
Voltage at any Logic PinNon-Supply Pin-0.3V DDIO +0.3V
Passive Storage Temp. Range≤65% rel. H.-50+150°C
None-volatile memory (NVM) Data RetentionT = 85°C, after 15 cycles10y
Mechanical ShockDuration 200 μs, half sine10,000g
Mechanical ShockDuration 1.0 ms, half sine2,000g
Mechanical ShockFree fall onto hard surfaces1.8m
ESDHBM, at any Pin2kV
CDM500V
MM200V

Note: Stresses above these listed maximum ratings may cause permanent damage to the device. Exposure beyond specified electrical characteristics as specified in Table 1 may affect device reliability or cause malfunction.

© Bosch Sensortec GmbH reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such as copying and passing on to third parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany. Note: Specifications within this document are preliminary and subject to change without notice.

Typical Application

  • Augmented Reality
  • Indoor navigation
  • 3D scanning / indoor mapping
  • Advanced gesture recognition
  • Immersive gaming
  • 9-axis motion detection
  • Air mouse applications and pointers
  • Pedometer / step counting
  • Advanced system power management for mobile applications
  • Optical image stabilization of camera modules
  • Free-fall detection and warranty logging
Data on this page is extracted from publicly available manufacturer datasheets using automated tools including AI. It may contain errors or omissions. Always verify specifications against the official manufacturer datasheet before making design or purchasing decisions. See our Terms of Service. Rights holders can submit a takedown request.

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