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BLM21PG221SN1B

The BLM21PG221SN1B is an electronic component from Murata. View the full BLM21PG221SN1B datasheet below including key specifications, pinout.

BLM21PG221SN1B shares its datasheet with BLM21PG221SN1D, whose page lists every part number it covers.

Official BLM21PG221SN1B datasheet (PDF) — the source this page was extracted from.

Manufacturer

Murata

BLM21PG221SN1B Key Specifications

ParameterValue
Impedance range (at 100MHz)5 Ω to 2700 Ω
Impedance tolerance±10 Ω to ±25% (depending on part number)
Rated Current (at 85°C)Up to 8500 mA (BLM21SN300SN1D/B)
Rated Current (at 125°C)Up to 6000 mA (BLM21SN300SN1D/B)
DC Resistance (Initial Values)0.004 Ω to 0.8 Ω max.
DC Resistance (Values After Testing)0.005 Ω to 0.9 Ω max.
Unit Mass (Typical value)0.010g (0.014g for 21BD222SN1 □ /21BD272SN1 □ )
Dimensions (L×W)2.0±0.2 mm × 1.25±0.2 mm

BLM21PG221SN1B Overview

Part: BLM21_ □ N Series — MURATA Type: Chip Ferrite Bead Description: Chip ferrite bead series with impedance values ranging from 5 Ω to 2700 Ω at 100 MHz, and rated currents up to 8500 mA, designed for noise suppression.

Operating Conditions:

  • Operating temperature: -55 to +125 °C (Storage)
  • Measuring temperature: 15 to 35 °C (Ordinary), 20±2 °C (In case of doubt)
  • Measuring humidity: 25 to 85 %RH (Ordinary), 60 to 70 %RH (In case of doubt)

Absolute Maximum Ratings:

  • Max junction/storage temperature: +125 °C

Key Specs:

  • Impedance range (at 100MHz): 5 Ω to 2700 Ω
  • Impedance tolerance: ±10 Ω to ±25% (depending on part number)
  • Rated Current (at 85°C): Up to 8500 mA (BLM21SN300SN1D/B)
  • Rated Current (at 125°C): Up to 6000 mA (BLM21SN300SN1D/B)
  • DC Resistance (Initial Values): 0.004 Ω to 0.8 Ω max.
  • DC Resistance (Values After Testing): 0.005 Ω to 0.9 Ω max.
  • Unit Mass (Typical value): 0.010g (0.014g for 21BD222SN1 □ /21BD272SN1 □ )
  • Dimensions (L×W): 2.0±0.2 mm × 1.25±0.2 mm

Features:

  • Resistance element becomes dominant at high frequencies for noise suppression.
  • Designed for solder mounting (reflow and flow soldering compatible).
  • Available in tape and reel packaging (paper tape or plastic tape) or bulk.

Applications:

  • Aircraft equipment (requires prior contact)
  • Aerospace equipment (requires prior contact)
  • Undersea equipment (requires prior contact)
  • Power plant control equipment (requires prior contact)
  • Medical equipment (requires prior contact)
  • Disaster prevention / crime prevention equipment (requires prior contact)
  • Traffic signal equipment (requires prior contact)
  • Transportation equipment (trains, ships, etc.) (requires prior contact)
  • Data-processing equipment (requires prior contact)

Package:

  • Chip (Dimensions: 2.0±0.2 mm × 1.25±0.2 mm)

BLM21PG221SN1B Applications

Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property.

  • (1) Aircraft equipment (6) Disaster prevention / crime prevention equipment
  • (2) Aerospace equipment (7) Traffic signal equipment
  • (3) Undersea equipment (8) Transportation equipment (trains,ships,etc.)
  • (4) Power plant control equipment (9) Data-processing equipment
  • (5) Medical equipment (10) Applications of similar complexity and /or reliability requirements to the applications listed in the above

BLM21PG221SN1B Pin Configuration

BLM21PG221SN1B — Chip Ferrite Bead (0805 Package)

Pin NumberPin NameTypeDescription
1Terminal 1I/OInput/Output terminal (one end of ferrite bead)
2Terminal 2I/OInput/Output terminal (other end of ferrite bead)

Notes

  • Package: 0805 (2.0 mm × 1.25 mm × 0.85 mm) chip ferrite bead
  • Impedance: 220 Ω ± 25% at 100 MHz
  • Rated Current: 2000 mA at 85°C; 1250 mA at 125°C
  • DC Resistance: 0.045 Ω max. (initial); 0.09 Ω max. (after testing)
  • No marking on the component itself
  • This is a two-terminal passive component (ferrite bead inductor). Pin numbering follows standard 0805 convention: Pin 1 is one end, Pin 2 is the other end.
  • The component is designed for solder mounting on PCB substrates.

BLM21PG221SN1B Package Information

  • Standard land dimensions
  • < BLM21 series(except BLM21PG/BLM21S type) >
  • < For BLM21PG/BLM21S type >

Total page 8/16

TypeRated CurrentLand pad thickness and dimension aLand pad thickness and dimension aLand pad thickness and dimension a
(A)18μm35μm70μm
BLM21PG1.51.01.01.0
BLM21PG21.21.01.0
BLM21PG3 ~ 42.41.21.0
BLM21PG66.43.31.65
BLM21S6 ~ 8.5-6.83.4

(in mm)

*The excessive heat by land pads may cause deterioration at joint of products with substrate.

More datasheets

All Murata datasheets (131)

Data on this page is extracted from publicly available manufacturer datasheets using automated tools including AI. It may contain errors or omissions. Always verify specifications against the official manufacturer datasheet before making design or purchasing decisions. See our Terms of Service. Rights holders can submit a takedown request.

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