BL602

The BL602 is an electronic component. View the full BL602 datasheet below including electrical characteristics, absolute maximum ratings.

Overview

Part: BL602/BL604 — Bouffalo Lab

Type: Wi-Fi + BLE Wireless Microcontroller

Description: The BL602/BL604 is a Wi-Fi + BLE combo chipset designed for ultra-low-cost and low-power applications, featuring a 32-bit RISC CPU with FPU, 276KB RAM, 128KB ROM, Wi-Fi 802.11b/g/n, and Bluetooth LE 5.0.

Operating Conditions:

Supply voltage: 3.0–3.6 V (for VDD33_DCDC, AVDD33_1, AVDD33_2, AVDD33_AON)
Operating temperature: -40 to +125 °C
CPU clock frequency: 1 to 192 MHz

Absolute Maximum Ratings:

Max supply voltage: 4.0 V (for VDD33_DCDC, AVDD33_1, AVDD33_2, AVDD33_AON, VDDIO_1)
Max junction/storage temperature: +150 °C

Key Specs:

CPU: 32-bit RISC with FPU
RAM: 276KB
ROM: 128KB
eFuse: 1Kb
Wi-Fi RX Sensitivity (11b - 1Mbps): -98 dBm (Typ @25°C)
Wi-Fi RX Sensitivity (11n - MCS7): -73 dBm (Typ @25°C)
GPIOs: 16 (QFN32) or 23 (QFN40) flexible GPIOs
ADC: 12-bit general ADC
DAC: 10-bit general DAC

Features:

2.4 GHz RF transceiver
Wi-Fi 802.11 b/g/n
Bluetooth® Low Energy 5.0
Integrated balun, PA/LNA
Secure boot, secure debug ports
QSPI Flash On-The-Fly AES Decryption (OTFAD)
AES 128/192/256 bits, SHA-1/224/256, TRNG, PKA
SDIO 2.0 slave, SPI master/slave, two UART, I2C master/slave
Five PWM channels, two general analog comparators (ACOMP)
PIR (Passive Infra-Red) detection, IR remote HW accelerator
Multiple power management modes: Off, Hibernate, Power Down Sleep, Active

Package:

QFN32
QFN40

Electrical Characteristics

Table 7.3: Recommended Temperature Operating Range

Table 7.3: Recommended Temperature Operating Range

Item	Item	Min.	Max.	Unit
Temperature	Main Die	-30	105	◦ C
	Multi-Die SiP	-30	85	◦ C

Table 7.4: General Operating Conditions

Item	Description	Min.	Typ	Max.	Unit
FCPU	CPU/TCM/Cache clock frequency	0	50	192	MHz
FSYS	System clock frequency	0	50	96	MHz

Table 7.4: General Operating Conditions

Absolute Maximum Ratings

Table 7.1: Absolute Maximum Rating

Pin Name	Min.	Max.	Unit
AVDD33_1	-0.3	3.63	V
AVDD33_2	-0.3	3.63	V
AVDD33_AON	-0.3	3.63	V
DVDD33_DCDC	-0.3	3.63	V
DVDDIO_1	-0.3	3.63	V
ESD Protection (HBM)		2000	V
Storage Temperature	-45	135	◦ C

Package Information

Figure 9.1: QFN32 Package drawing

Table 9.1: QFN32 Size Description(Units Of Measure=Millimeter)

SYMBOL	MIN	NOM	MAX
A	0.7	0.75	0.8
A1	0	0.02	0.05

Table 9.1: QFN32 Size Description(Units Of Measure=Millimeter)

Table 9.1: QFN32 Size Description(Units Of Measure=Millimeter)

SYMBOL	MIN	NOM	MAX
A2	0.50	0.55	0.60
A3	0.20REF	0.20REF	0.20REF
b	0.15	0.20	0.25
D	3.90	4.00	4.10
E	3.90	4.00	4.10
D2	2.80	2.90	3.00
E2	2.80	2.90	3.00
e	0.30	0.40	0.50
H	0.30REF	0.30REF	0.30REF
K	0.25REF	0.25REF	0.25REF
L	0.25	0.30	0.35
R	0.09	-	-
c1	-	0.10	-
c2	-	0.10	-

Table 9.1: QFN32 Size Description(Units Of Measure=Millimeter)

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