BL602
The BL602 is an electronic component. View the full BL602 datasheet below including pinout, electrical characteristics, absolute maximum ratings.
Overview
Part: BL602/BL604 — Bouffalo Lab
Type: Wi-Fi + BLE Wireless Microcontroller
Description: The BL602/BL604 is a Wi-Fi + BLE combo chipset designed for ultra-low-cost and low-power applications, featuring a 32-bit RISC CPU with FPU, 276KB RAM, 128KB ROM, Wi-Fi 802.11b/g/n, and Bluetooth LE 5.0.
Operating Conditions:
- Supply voltage: 3.0–3.6 V (for VDD33_DCDC, AVDD33_1, AVDD33_2, AVDD33_AON)
- Operating temperature: -40 to +125 °C
- CPU clock frequency: 1 to 192 MHz
Absolute Maximum Ratings:
- Max supply voltage: 4.0 V (for VDD33_DCDC, AVDD33_1, AVDD33_2, AVDD33_AON, VDDIO_1)
- Max junction/storage temperature: +150 °C
Key Specs:
- CPU: 32-bit RISC with FPU
- RAM: 276KB
- ROM: 128KB
- eFuse: 1Kb
- Wi-Fi RX Sensitivity (11b - 1Mbps): -98 dBm (Typ @25°C)
- Wi-Fi RX Sensitivity (11n - MCS7): -73 dBm (Typ @25°C)
- GPIOs: 16 (QFN32) or 23 (QFN40) flexible GPIOs
- ADC: 12-bit general ADC
- DAC: 10-bit general DAC
Features:
- 2.4 GHz RF transceiver
- Wi-Fi 802.11 b/g/n
- Bluetooth® Low Energy 5.0
- Integrated balun, PA/LNA
- Secure boot, secure debug ports
- QSPI Flash On-The-Fly AES Decryption (OTFAD)
- AES 128/192/256 bits, SHA-1/224/256, TRNG, PKA
- SDIO 2.0 slave, SPI master/slave, two UART, I2C master/slave
- Five PWM channels, two general analog comparators (ACOMP)
- PIR (Passive Infra-Red) detection, IR remote HW accelerator
- Multiple power management modes: Off, Hibernate, Power Down Sleep, Active
Package:
- QFN32
- QFN40
Pin Configuration
BL602 QFN32 Pinout
| Pin | Name | Type | Description |
|---|---|---|---|
| 1 | PAD_GPIO_0 | Digital | SDIO, SFLASH, SPI, I2C, UART, PWM, GPIO |
| 2 | PAD_GPIO_1 | Digital | SDIO, SFLASH, SPI, I2C, UART, PWM, GPIO |
| 3 | PAD_GPIO_2 | Digital | SDIO, SFLASH, SPI, I2C, UART, PWM, GPIO |
| 4 | PAD_GPIO_3 | Digital | SDIO, SPI, I2C, UART, PWM, GPIO |
| 5 | PAD_GPIO_4 | Digital | SDIO, SPI, I2C, UART, PWM, GPIO |
| 6 | PAD_GPIO_5 | Digital | SDIO, SPI, I2C, UART, PWM, GPIO |
| 7 | AVDD33_1 | Power | Externally powered 3.3V |
| 8 | AVDD33_2 | Power | Externally powered 3.3V |
| 9 | ANT | Analog | RF input and output (single pin) |
| 10 | VDD15_RF | Power | RF power 1.5V |
| 11 | AVDD18_RF | Power | RF power 1.8V |
| 12 | CHIP_EN | Digital | Chip enable |
| 13 | XTAL32K_IN | Analog | Crystal oscillator 32.768KHz input |
| 14 | XTAL32K_OUT | Analog | Crystal oscillator 32.768KHz output |
| 15 | AVDD33_AON | Power | Externally powered 3.3V |
| 16 | PAD_GPIO_7 | Digital | SPI, I2C, UART, PWM, AUXADC, GPIO |
| 17 | PAD_GPIO_8 | Digital | SPI, I2C, UART, PWM, AUXADC, GPIO |
| 18 | XTAL_IN | Analog | External crystal input, support 24/32/38.4/40MHz |
| 19 | XTAL_OUT | Analog | External crystal output, support 24/32/38.4/40MHz |
| 20 | PAD_GPIO_11 | Digital | SPI, I2C, UART, PWM, AUXADC, GPIO |
| 21 | PAD_GPIO_12 | Digital | SPI, I2C, UART, PWM, AUXADC, GPIO |
| 22 | PAD_GPIO_14 | Digital | SPI, I2C, UART, PWM, AUXADC, GPIO |
| 23 | VDD33_DCDC | Power | DCDC |
| 24 | SW_DCDC | Power | DCDC |
| 25 | DCDC_OUT | Power | DCDC |
| 26 | VDDCORE | Power | Core Power |
| 27 | PAD_GPIO_16 | Digital | SPI, I2C, UART, PWM, GPIO |
| 28 | PAD_GPIO_17 | Digital | SFLASH, SPI, I2C, UART, PWM, GPIO |
| 29 | PAD_GPIO_20 | Digital | SFLASH, SPI, I2C, UART, PWM, GPIO |
| 30 | PAD_GPIO_21 | Digital | SFLASH, SPI, I2C, UART, PWM, GPIO |
| 31 | PAD_GPIO_22 | Digital | SFLASH, SPI, I2C, UART, PWM, GPIO |
| 32 | DVDDIO_1 | Power | Externally powered 3.3V or 1.8V |
Notes
- BL602 is the 32-pin QFN variant with 16 flexible GPIO pins (GPIO_0–5, GPIO_7–8, GPIO_11–12, GPIO_14, GPIO_16–17, GPIO_20–22).
- DVDDIO_1 (pin 32) supports dual voltage: 3.3V or 1.8V operation.
- RF antenna connection via single ANT pin (pin 9).
- Crystal oscillator support: 32.768 kHz (pins 13–14) and main XTAL 24/32/38.4/40 MHz (pins 18–19).
- DCDC power supply pins: VDD33_DCDC (pin 23), SW_DCDC (pin 24), DCDC_OUT (pin 25).
Electrical Characteristics
Table 7.3: Recommended Temperature Operating Range
Table 7.3: Recommended Temperature Operating Range
| Item | Item | Min. | Max. | Unit |
|---|---|---|---|---|
| Temperature | Main Die | -30 | 105 | ◦ C |
| Multi-Die SiP | -30 | 85 | ◦ C |
Table 7.4: General Operating Conditions
| Item | Description | Min. | Typ | Max. | Unit |
|---|---|---|---|---|---|
| FCPU | CPU/TCM/Cache clock frequency | 0 | 50 | 192 | MHz |
| FSYS | System clock frequency | 0 | 50 | 96 | MHz |
Table 7.4: General Operating Conditions
Absolute Maximum Ratings
Table 7.1: Absolute Maximum Rating
| Pin Name | Min. | Max. | Unit |
|---|---|---|---|
| AVDD33_1 | -0.3 | 3.63 | V |
| AVDD33_2 | -0.3 | 3.63 | V |
| AVDD33_AON | -0.3 | 3.63 | V |
| DVDD33_DCDC | -0.3 | 3.63 | V |
| DVDDIO_1 | -0.3 | 3.63 | V |
| ESD Protection (HBM) | 2000 | V | |
| Storage Temperature | -45 | 135 | ◦ C |
Package Information
Figure 9.1: QFN32 Package drawing
Table 9.1: QFN32 Size Description(Units Of Measure=Millimeter)
| SYMBOL | MIN | NOM | MAX |
|---|---|---|---|
| A | 0.7 | 0.75 | 0.8 |
| A1 | 0 | 0.02 | 0.05 |
Table 9.1: QFN32 Size Description(Units Of Measure=Millimeter)
Table 9.1: QFN32 Size Description(Units Of Measure=Millimeter)
| SYMBOL | MIN | NOM | MAX |
|---|---|---|---|
| A2 | 0.50 | 0.55 | 0.60 |
| A3 | 0.20REF | 0.20REF | 0.20REF |
| b | 0.15 | 0.20 | 0.25 |
| D | 3.90 | 4.00 | 4.10 |
| E | 3.90 | 4.00 | 4.10 |
| D2 | 2.80 | 2.90 | 3.00 |
| E2 | 2.80 | 2.90 | 3.00 |
| e | 0.30 | 0.40 | 0.50 |
| H | 0.30REF | 0.30REF | 0.30REF |
| K | 0.25REF | 0.25REF | 0.25REF |
| L | 0.25 | 0.30 | 0.35 |
| R | 0.09 | - | - |
| c1 | - | 0.10 | - |
| c2 | - | 0.10 | - |
Table 9.1: QFN32 Size Description(Units Of Measure=Millimeter)
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