ADG143X

Part: ADG1434 — Analog Devices Type: Quad SPDT Analog Switch Description: The ADG1434 is a monolithic industrial CMOS analog switch comprising four independently selectable single-pole, double-throw (SPDT) switches with 4.7 Ω maximum on resistance and up to 115 mA continuous current per channel.

Operating Conditions:

• Supply voltage: ±4.5 V to ±16.5 V (dual supply), 5 V to 16.5 V (single supply)
• Operating temperature: -40°C to +125°C
• Logic input voltage: 2.0 V min (high), 0.8 V max (low)

Absolute Maximum Ratings:

• Max supply voltage (VDD to VSS): 35 V
• Max continuous current (S or D): Data + 15% (up to 115 mA for ADG1433, 100 mA for ADG1434 at ±15V, 25°C)
• Max junction temperature: 150°C

Key Specs:

• On Resistance (RON): 4.7 Ω max (at +25°C, ±15 V supply, IS = -10 mA)
• On Resistance Flatness (RFLAT(ON)): 0.72 Ω max (at +25°C, ±15 V supply, IS = -10 mA)
• Analog Signal Range: VSS to VDD
• Source Off Leakage (IS(Off)): ±0.3 nA max (at +25°C, ±15 V supply)
• Transition Time (tTRANS): 200 ns max (at +25°C, ±15 V supply, RL = 100 Ω, CL = 35 pF)
• Break-Before-Make Time Delay (tD): 30 ns min (at +25°C, ±15 V supply, VS1 = VS2 = 10 V)
• Continuous Current per Channel (ADG1434): 100 mA max (at +25°C, ±15 V supply)
• -3 dB Bandwidth: 200 MHz typ (at +25°C, ±15 V supply, RL = 50 Ω, CL = 5 pF)

Features:

• 4.7 Ω maximum on resistance @ 25°C
• 0.5 Ω on resistance flatness
• Fully specified at ±15 V/+12 V/±5 V
• 3 V logic-compatible inputs
• Up to 115 mA continuous current per channel
• Rail-to-rail operation
• Break-before-make switching action

Applications:

• Relay replacement
• Audio and video routing
• Automatic test equipment
• Data acquisition systems
• Temperature measurement systems
• Avionics
• Battery-powered systems
• Communication systems
• Medical equipment

Package:

• 20-lead TSSOP
• 4 mm × 4 mm LFCSP_VQ

4.7 Ω maximum on resistance @ 25°C 0.5 Ω on resistance flatness Fully specified at ±15 V/+12 V/±5 V 3 V logic-compatible inputs Up to 115 mA continuous current per channel Rail-to-rail operation Break-before-make switching action

16-/20-lead TSSOP and 4 mm × 4 mm LFCSP_VQ packages

Relay replacement Audio and video routing Automatic test equipment Data acquisition systems Temperature measurement systems Avionics Battery-powered systems Communication systems Medical equipment

Figure 4. ADG1433 TSSOP Pin Configuration

θJA is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages.