74HC138

Part: SN54HC138, SN74HC138 from Texas Instruments

Type: 3-Line To 8-Line Decoders/Demultiplexers

Key Specs:

• Operating Voltage Range: 2 V to 6 V
• Maximum ICC: 80-µA
• Typical tpd: 15 ns
• Output Drive: ±4-mA at 5 V
• Maximum Input Current: 1-µA

Features:

• Targeted Specifically for High-Speed Memory Decoders and Data-Transmission Systems
• Wide Operating Voltage Range (2 V to 6 V)
• Outputs Can Drive Up To 10 LSTTL Loads
• Low Power Consumption, 80-µA Maximum ICC
• Typical tpd = 15 ns
• ±4-mA Output Drive at 5 V
• Low Input Current of 1-µA Maximum
• Active Low Outputs ( Selected Output is Low)
• Incorporate Three Enable Inputs to Simplify Cascading or Data Reception

Applications:

• LED Displays
• Servers
• White Goods
• Power Infrastructure
• Building Automation
• Factory Automation

Package:

• SOIC (16): 9.90 mm x 3.90 mm
• SSOP (16): 6.20 mm x 5.30 mm
• PDIP (16): 19.32 mm x 6.35 mm
• SO (16): 10.20 mm x 5.30 mm
• TSSOP (16): 5.00 mm x 4.40 mm
• CDIP (16): 21.34 mm x 6.92 mm
• CFP (16): 10.16 mm x 6.73 mm
• LCCC (20): 8.89 mm x 8.89 mm

• Targeted Specifically for High-Speed Memory Decoders and Data-Transmission Systems
• Wide Operating Voltage Range (2 V to 6 V)
• Outputs Can Drive Up To 10 LSTTL Loads
• Low Power Consumption, 80-µA Maximum ICC
• Typical tpd = 15 ns
• ±4-mA Output Drive at 5 V
• Low Input Current of 1-µA Maximum
• Active Low Outputs ( Selected Output is Low)
• Incorporate Three Enable Inputs to Simplify Cascading or Data Reception

• LED Displays
• Servers
• White Goods
• Power Infrastructure
• Building Automation
• Factory Automation

SOIC, SSOP, PDIP, SO, TSSOP, CDIP, or CFP Package 16-Pin D, DB, N, NS, PW, J or W Top View

NC: No internal connection LCCC Package 20-Pin FK Top View

Pin Functions

| | PIN | |------|-------------------------------------------|--------------|--------|----------------------------------------| | NAME | SOIC, SSOP, PDIP, SO,
TSSOP, CDIP, CFP | LCCC | I/O(1) | DESCRIPTION | | A | 1 | 2 | I | Select input A (least significant bit) | | B | 2 | 3 | I | Select input B | | C | 3 | 4 | I | Select input C (most significant bit) | | G2A | 4 | 5 | I | Active low enable A | | G2B | 5 | 7 | I | Active low enable B | | G1 | 6 | 8 | I | Active high enable | | GND | 8 | 10 | — | Ground | | NC | — | 1, 6, 11, 16 | — | No internal connection | | VCC | 16 | 20 | — | Supply voltage | | Y0 | 15 | 19 | O | Output 0 (least significant bit) | | Y1 | 14 | 18 | O | Output 1 | | Y2 | 13 | 17 | O | Output 2 | | Y3 | 12 | 15 | O | Output 3 | | Y4 | 11 | 14 | O | Output 4 | | Y5 | 10 | 13 | O | Output 5 | | Y6 | 9 | 12 | O | Output 6 | | Y7 | 7 | 9 | O | Output 7 (most significant bit) |

⁽¹⁾ Signal Types: I = Input, O = Output, I/O = Input or Output.

TA = 25°C (unless otherwise noted)

⁽²⁾ RθJC follows MIL-STD-883, and RθJB follows JESD51.

over operating free-air temperature range (unless otherwise noted)(1)

⁽¹⁾ Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

over operating free-air temperature range (unless otherwise noted)(1)

4 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated

⁽²⁾ The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

⁽²⁾ JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

| | | SN74HC138 | |-------------------|-------------------------------------------------|-----------|-----------|----------|---------|------------|------| | THERMAL METRIC(1) | | D (SOIC) | DB (SSOP) | N (PDIP) | NS (SO) | PW (TSSOP) | UNIT | | | | 16 PINS | 16 PINS | 16 PINS | 16 PINS | 16 PINS | | RθJA | Junction-to-ambient thermal resistance | 87.3 | 104.3 | 54.8 | 91.1 | 141.6 | °C/W | | RθJC(top) | Junction-to-case (top) thermal resistance | 45.8 | 54.7 | 42.1 | 49.5 | 49.5 | °C/W | | RθJB | Junction-to-board thermal resistance | 44.8 | 54.9 | 34.8 | 51.5 | 59.6 | °C/W | | ψJT | Junction-to-top characterization parameter | 14.2 | 17.7 | 27 | 17.8 | 6.9 | °C/W | | ψJB | Junction-to-board characterization
parameter | 44.5 | 54.4 | 34.7 | 51.2 | 59.1 | °C/W |

⁽¹⁾ For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.