1N4148

Glass Axial Switching Diode

Manufacturer

unknown

Overview

Part: 1N4148-1 from Microsemi

Type: Glass Axial Switching Diode

Key Specs:

  • Junction and Storage Temperature: -65 to +175 °C
  • Thermal Resistance Junction-to-Lead: 250 °C/W
  • Thermal Resistance Junction-to-Ambient: 325 °C/W
  • Maximum Breakdown Voltage: 100 V
  • Working Peak Reverse Voltage: 75 V
  • Average Rectified Current @ TA = 75 °C: 200 mA
  • Non-Repetitive Sinusoidal Surge Current (tp = 8.3 ms): 2 A (pk)

Features:

  • Popular JEDEC registered 1N4148 number.
  • Hermetically sealed glass construction.
  • Metallurgically bonded.
  • Double plug construction.
  • Very low capacitance.
  • Very fast switching speeds with minimal reverse recovery times.
  • JAN, JANTX, and JANTXV qualifications are available per MIL-PRF-19500/116.
  • MSP screening is also available in reference to MIL-PRF-19500 (JANS).
  • RoHS compliant version available (commercial grade only).

Applications:

  • High frequency data lines.
  • Small size for high density mounting using flexible thru-hole leads.
  • RS-232 & RS–422 interface networks.
  • Ethernet 10 base T.
  • Low capacitance steering or blocking.
  • LAN.
  • Computers.

Package:

  • DO-35 (double-plug)
  • DO-213AA (surface mount)
  • UB package (surface mount)
  • UB2 package (2-Pin surface mount)
  • UBC package (Ceramic Lid surface mount)

Features

  • Popular JEDEC registered 1N4148 number.
  • Hermetically sealed glass construction.
  • Metallurgically bonded.
  • Double plug construction.
  • Very low capacitance.
  • Very fast switching speeds with minimal reverse recovery times.
  • JAN, JANTX, and JANTXV qualifications are available per MIL-PRF-19500/116.
  • MSP screening is also available in reference to MIL-PRF-19500 (JANS). (See part nomenclature for all available options.)
  • RoHS compliant version available (commercial grade only).

Applications

  • High frequency data lines.
  • Small size for high density mounting using flexible thru-hole leads (see package illustration).
  • RS-232 & RS–422 interface networks.
  • Ethernet 10 base T.
  • Low capacitance steering or blocking.
  • LAN.
  • Computers.

Electrical Characteristics

FORWARD
VOLTAGE
VF1 @
IF=10 mA		FORWARD
VOLTAGE
VF2 @
IF=100 mA		REVERSE
RECOVERY
TIME
trr
(Note 1)		FORWARD
RECOVERY
TIME
tfr
(Note 2)		REVERSE
CURRENT
IR1 @ 20 V		REVERSE
CURRENT
IR2 @ 75 V		REVERSE
CURRENT
IR3
@ 20 V
TA=150o
C		REVERSE
CURRENT
IR4
@ 75 V
TA=150o
C		CAPACI
TANCE
C
(Note 3)		CAPACI
TANCE
C
(Note 4)
VVnsnsnAµAµAµApFpF
NOTE 1: IF = IR = 10 mA, RL = 100 Ohms. NOTE 3: VR = 0 V, f = 1 MHz, VSIG = 50 mV (pk to pk). NOTE 2: IF = 50 mA. NOTE 4: VR = 1.5V, f = 1 MHz, VSIG = 50 mV (pk to pk).

GRAPHS

FIGURE 1 – Temperature – Current Derating

FIGURE 2 – Thermal Impedance

Absolute Maximum Ratings

Parameters/Test ConditionsSymbolValueUnit
Junction and Storage TemperatureTJ & TSTG-65 to +175o
C
Thermal Resistance Junction-to-Lead (1)RӨJL250o
C/W
Thermal Resistance Junction-to-Ambient (2)RӨJA325o
C/W
Maximum Breakdown VoltageV(BR)100V
Working Peak Reverse VoltageVRWM75V
Average Rectified Current @ TA = 75 ºC (3)IO200mA
Non-Repetitive Sinusoidal Surge Current (tp = 8.3 ms)IFSM2A (pk)

NOTES: 1. Lead length = .375 inch (9.35 mm). See Figure 2 for thermal impedance curves.

    1. TA = +75°C on printed circuit board (PCB), PCB = FR4 .0625 inch (1.59 mm) 1-layer 1-Oz Cu, horizontal, in still air; pads for axial = .092 inch (2.34 mm) diameter, strip = .030 inch (0.76 mm) x 1 inch (25.4 mm) long, lead length L ≤ 0.187 inch (≤ 4.75 mm); RӨJA with a defined PCB thermal resistance condition included, is measured at IO = 200 mA.
    1. See Figure 1 for derating.

Also available in:

Package

DO-213AA package (surface mount) 1N4148UR-1

UB package (surface mount)

1N4148UB

UB2 package (2-Pin surface mount) 1N4148UB2

UBC package (Ceramic Lid surface mount) 1N4148UBC

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